ELESTIN-300

Process

  • Electroless Tin Plating

Explanation

  • ELESTIN-300 is an immersion tin plating solution specially designed for final finish of copper based PCBs, lead-frames and/or other electronic components with higher performance and higher reliability, which is compatible with both vertical and horizontal plating system

Advantages

  • Dense and uniform deposit structure
  • Higher deposit thickness up to 2 ㎛
  • Excellent solderability and edge coverage of improperly plated PCBs
  • Inhibition of IMC and Whisker formation
  • No solder mask attack