SP-900
Process
- Silver Plating
Explanation
- SP-900 is a high speed low cyanide silver plating formulation which produces a fine grained deposits over a wide range of current densities
- SP-900 is designed to produce electronics parts of wire bonding such as lead frame and connector
Advantages
- Flexible, glossy plated deposits
- Excellent wire-bonding and soldering
- Easy to control with a wide current density
- Possible to plate a long time compared with other plating process. Because SP-900 process doesn’t contain component which can be decomposed by electrolysis and hydrolysis
- Possible to apply low speed plating process to produce connector and control solution easily