CSP-400

Process

  • Cyanide Copper Strike Plating

Explanation

  • CSP-400 is a single brightener additive process that can be operated over
    a wide range of concentrations under a variety of operating condition
    in cyanide copper plating process
  • The CSP-400 does not decompose and is relatively unaffected by presence
    of organic and metallic contaminants that affect other brightener systems

Advantages

  • The wide range of additives makes it more stable and easy to use
  • High current density can be managed, so high speed plating is possible
  • It has excellent throwing and covering power