| AT-S1 |
Anti-Tarnish for Silver |
- AT-S1 prevents oxidation and discoloration of the silver plating surface, but is also effective as a Sealing agent for various metal plating
- It can be used in a variety of fields, including electronic products such as connectors and contacts, as well as accessories
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- Does not contain heavy metals such as chromic acid
- Excellent durability in preventing discoloration
- Low contact resistance and does not affect electrical conductivity or solderabilty
- No external defects such as stains or marks on the plating surface caused by rinse
- Very resistant to heat and moisture
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| PREDIP S-3 |
Anti-Immersion Silver Agent |
- PREDIP S-3 is a pre-treatment process specially developed to inhibit silver substitution deposits for silver plating
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- It is especially designed for use on lead frame treated with copper strike
- It has many effects for wettability and for even-silver deposits
- It has many effects for pre-treatment in high speed silver plating process
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| SP-900 |
Silver Plating |
- SP-900 is a high speed low cyanide silver plating formulation which produces a fine grained deposits over a wide range of current densities
- SP-900 is designed to produce electronics parts of wire bonding such as lead frame and connector
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- Flexible, glossy plated deposits
- Excellent wire-bonding and soldering
- Easy to control with a wide current density
- Possible to plate a long time compared with other plating process. Because SP-900 process doesn’t contain component which can be decomposed by electrolysis and hydrolysis
- Possible to apply low speed plating process to produce connector and control solution easily
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| AGS-200 |
Silver Stripper |
- AGS-200 is Stripper for Ag on Copper and Copper alloy
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- Very slight variation of pH , and small amount of replenishment
- No tarnish and no residual on the surface of Ag deposits
- Double speed stripping time compare with other type stripper at low current density
- According to L/F type, one week to one month of use is possible
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