Products Process Explanation Advantages
TINBRIGHT SN Tin plating
  • TINBRIGHT SN is designed to produce extremely bright to matte tin deposits from sulfate based plating solutions
  • Properly plated deposits pass the solderability Test of ASTM B678-86. It can be used for machine parts, accessories, electronic parts, semiconductor parts, P.C.B, automotive parts and so on
  • Stannous sulfate based type, bright to matte tin deposits
  • No fine crack deposit because of excellent soldering ability and ductility
  • Excellent corrosion resistance
  • Possible to do plating 2.5㎛ for 2min. at 2A/dm2
  • Designed for rack and barrel operations
SN-RS Rack Stripper
  • SN-RS is a stripper of tin deposits and tin rack stripper, especially formulated to peel off tin deposits with minimal damage of base materials such as machine parts, accessories, electronic parts, semiconductor parts, P.C.B board, connector parts, automotive parts and so on
  • Possible to peel off tin deposits quickly with minimal damage of base metal
  • Easy to use as it can be removed only by immersion
  • No need for a separate heating device due to work at room temperature
  • Usable the rack for a long-term, because base metal damage is minimized
SN-AT Anti-Tarnish
  • SN-AT is a anti-tarnish agent for tin and tin alloy deposits. In addition, it has the function of improving corrosion resistant
  • It is particularly effective in preventing deterioration of soldering ability due to heat discoloration of tin and tin alloy plated products
  • Does not cause stains or discoloration on the plated surface
  • When heating, the effect of anti-tarnish is shown and the deterioration of soldering ability is greatly suppressed
  • It is easy to manage with a simple titration method
  • It’s a anti-tarnish agent that does not contain heavy metals
ELESTIN-300 Electroless Tin Plating
  • ELESTIN-300 is an immersion tin plating solution specially designed for final finish of copper based PCBs, lead-frames and/or other electronic components with higher performance and higher reliability, which is compatible with both vertical and horizontal plating system
  • Dense and uniform deposit structure
  • Higher deposit thickness up to 2 ㎛
  • Excellent solderability and edge coverage of improperly plated PCBs
  • Inhibition of IMC and Whisker formation
  • No solder mask attack