Products Process Explanation Advantages
LB-1 Anti-RBO
  • LB-1 is concentrated liquid type that is used for an Anti-Resin Bleed Out of epoxy resin after Die Attach process
  • Changes the property of silver plated surface to get rid of Resin Bleed Out during Assembly Process
  • The most suitable for electronic parts such as IC Lead Frame, PWB (Printed Wiring Board) and LED (Light Emitting Diode)
  • Performs excellent Anti-Resin Bleed out effect on the silver surface and copper surface
  • Never deteriorate the properties such as soldering, bonding, adhesive of chips and electro-properties
  • Film on the silver and copper surface can be easily removed with dipping in acid or alkaline solution
AT-10 Anti-Tarnish
  • AT-10 can prevent epoxy bleed-out between lead frame’s Ag surface and chip, during semiconductor assembly process
  • And also it can prevent oxidation on copper surface of lead frame
  • Prevent the oxidation on the copper surface
  • Prevent the epoxy bleed-out on the Ag surface
  • Prevent the CPO defect on the copper surface
  • No effect on the bonding during wire bonding process
EC-100 Degreaser
  • EC-100 is an alkali type electrolytic degreaser for copper, copper alloy and steel
  • Excellent ability to remove oils, grease, stain and fats on the metal surface
  • Less influence by metal contamination mixed in the degreasing bath
  • Good electrical conductivity, so it can b e sued in a wide current range
PREDIP S-3 Anti-Immersion Silver Agent
  • PREDIP S-3 is a pre-treatment process specially developed to inhibit silver substitution deposits for silver plating
  • It is especially designed for use on lead frame treated with copper strike
  • It has many effects for wettability and for even-silver deposits
  • It has many effects for pre-treatment in high speed silver plating process
SP-900 High Speed Low Cyanide Silver Plating Process
  • SP-900 is a high speed low cyanide silver plating formulation which produces a fine grained deposits over a wide range of current densities
  • SP-900 is designed to produce electronics parts of wire bonding such as lead frame and connector
  • Flexible, glossy plated deposits
  • Excellent wire-bonding and soldering
  • Easy to control with a wide current density
  • Possible to plate a long time compared with other plating process. Because SP-900 process doesn’t contain component which can be decomposed by electrolysis and hydrolysis
  • Possible to apply low speed plating process to produce connector and control solution easily
AGS-200 Silver Stripper
  • AGS-200 is Stripper for Ag on Copper and Copper alloy
  • Very slight variation of pH , and small amount of replenishment
  • No tarnish and no residual on the surface of Ag deposits
  • Double speed stripping time compare with other type stripper at low current density
  • According to L/F type, one week to one month of use is possible