SP-900

Process

  • High Speed Low Cyanide Silver Plating Process

Explanation

  • SP-900 is a high speed low cyanide silver plating formulation which
    produces a fine grained deposits over a wide range of current densities
  • SP-900 is designed to produce electronics parts of wire bonding
    such as lead frame and connector

Advantages

  • Flexible, glossy plated deposits
  • Excellent wire-bonding and soldering
  • Easy to control with a wide current density
  • Possible to plate a long time compared with other plating process.
    Because SP-900 process doesn’t contain component which can be
    decomposed by electrolysis and hydrolysis
  • Possible to apply low speed plating process to produce connector
    and control solution easily