AT-10

Process

  • Anti-Tarnish

Explanation

  • AT-10 can prevent epoxy bleed-out between lead frame’s Ag surface
    and chip, during semiconductor assembly process
  • And also it can prevent oxidation on copper surface of lead frame

Advantages

  • Prevent the oxidation on the copper surface
  • Prevent the epoxy bleed-out on the Ag surface
  • Prevent the CPO defect on the copper surface
  • No effect on the bonding during wire bonding process