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LB-1
Process
- Anti-RBO
Explanation
- LB-1 is concentrated liquid type that is used for an Anti-Resin
Bleed Out of epoxy resin after Die Attach process - Changes the property of silver plated surface to get rid of Resin
Bleed Out during Assembly Process - The most suitable for electronic parts such as IC Lead Frame,
PWB (Printed Wiring Board) and LED (Light Emitting Diode)
Advantages
- Performs excellent Anti-Resin Bleed out effect on the silver
surface and copper surface - Never deteriorate the properties such as soldering, bonding,
adhesive of chips and electro-properties - Film on the silver and copper surface can be easily removed
with dipping in acid or alkaline solution