LB-1

Process

  • Anti-RBO

Explanation

  • LB-1 is concentrated liquid type that is used for an Anti-Resin
    Bleed Out of epoxy resin after Die Attach process
  • Changes the property of silver plated surface to get rid of Resin
    Bleed Out during Assembly Process
  • The most suitable for electronic parts such as IC Lead Frame,
    PWB (Printed Wiring Board) and LED (Light Emitting Diode)

Advantages

  • Performs excellent Anti-Resin Bleed out effect on the silver
    surface and copper surface
  • Never deteriorate the properties such as soldering, bonding,
    adhesive of chips and electro-properties
  • Film on the silver and copper surface can be easily removed
    with dipping in acid or alkaline solution